Megasonic / Ultrasonic

Technical Briefs

TB 34: Liqui-Cel® Membrane Contactors are used to Improve Performance of Megasonic Cleaning
Megasonic Cleaning challenges are solved with total gas control using Liqui-Cel® Contactors. Remove O2 from water while adding N2 to water.

TB 41: Activated Water for Improved Megasonic Cleaning
Improved megasonic wafer cleaning with activated water using hydrogen and Liqui-Cel® Contactors.

TB 44: Precise Control of Dissolved O2 and N2
Precise Control of O2 and N2 gasses in Semiconductor wafer cleaning applications.

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Megasonic irradiation is a common process used to remove particles, metals and organics from the surfaces of semiconductors and other materials. This process requires water baths where the semiconductor wafers are immersed and ultrasonic pulses are sent through the water to dislodge any of these contaminants. If bubbles are present in the water bath, the megasonic process is negatively impacted. At the same time, it has also been proven that a small amount of hydrogen or nitrogen dissolved into the megasonic water bath is helpful to the cleaning process. Liqui-Cel Membrane Contactors are an ideal solution to improve the cleaning performance of Megasonic baths because they can remove oxygen and dissolve nitrogen or hydrogen into the water in one step. Liqui-Cel Contactors diffuse the gas into the water on a molecular level in a very controlled manner so that no bubbling occurs. Bubbles will also have a negative impact on the cleaning process so the molecular diffusion of gasses is very important.